| Imikhiqizo ihlukaniswa | Imodeli | Isilinganiso sikasayizi wezinhlayiyana (nm) | Ubumsulwa (%) | Indawo ethile engaphezulu (m2/g) | Ukuminyana kwenqwaba (g/cm3) | Ama-Polymorphs | Umbala | | I-Nanoscale | I-DK-Ag-001 | 20 | > 99.9 | 42.0 | 0.5 | I-Globular | Okumpunga | | I-Submicron | I-DK-Ag-002 | 400 | > 99.9 | 24.9 | 1.58 | I-Globular | Okumpunga |
Izici eziyinhloko
I-powder esiliva ephansi kaphayini, ukuhamba;
Izingqimba ezimbili ze-conductive zesiliva se-powder surface roughness, conductivity enhle;
Izinto ezintathu zokugcwalisa ezisebenza kahle kakhulu, ezinokumelana okuhle ne-oxidation.Isetshenziswa kabanzi kuma-pastes e-elekthronikhi, imikhiqizo ye-elekthronikhi, i-electromagnetic shielding, i-anti-bacterial anti-virus.
Izinhlelo zokusebenza
Ifilimu, i-microfiber;
2 ABS, PC, PVC kanye nezinye substrates plastic;
3 ama-antibacterial, ama-antimicrobial agents;
4 isebenzise i-high-tempering sintering conductive paste kanye ne-low-temperature polymer conductive paste;
I-5 powder yesiliva: isilinganiso sikasayizi wezinhlayiyana zama-microns angu-0.4, uchungechunge lwe-powder encane yesiliva isetshenziswa ikakhulukazi ku-filler conductive ye-high-temperature sintering conductive paste, uchungechunge lwenhlanganisela yesiliva ukufeza izinhloso ezahlukene zokufaka imiphumela nayo ingasetshenziswa njenge i-catalyst, izinto ezilwa namagciwane nezinye izinjongo ezikhethekile;Isiliva eli-6 lisetshenziselwa ikakhulukazi ukumboza okwenziwayo, oyinki be-conductive, i-filler conductive ye-polymer conductive paste;izinto zokugcwalisa ezisebenza kahle kakhulu, ezinokumelana okuhle ne-oxidation.Isetshenziswa kabanzi kuma-pastes e-elekthronikhi, imikhiqizo ye-elekthronikhi, i-electromagnetic shielding, i-anti-bacterial anti-virus.
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